Enabling tailored market applications

NIRSEN provides world-class semiconductor design and engineering services for all industries.

AMS, RF & mmWave IC design

Years of experience for your next success story

NIRSEN is a chip engineering service company, specializing in millimeter-wave and AMS circuits and front-end systems, with premium references. Explore our analog IPs or order custoized IC services.

SoC FPGA and ASIC design

Excellence achieved through demanding projects

We provide digital ASIC and FPGA design services as well as soft and hard implementation of digital signal processing. Discover our expertise in highly complex sensor fusion, HIL (hardware-in-the-loop), and multigigabit wireless communication solutions.

hypr_ Real-Time Processing & Logging Platforms

Unprecedented data processing speed

hypr_ (hyperspace) is our proprietary program of real-time logging and processing platforms for radar, camera, lidar, and other sensor systems. Learn how to leverage hypr_ to increase the performance of your applications.

NIRSEN IPs and Competencies

Solutions are developed for each customer individually, tailored to their customer-specific requirements, while the customer retains all IPs and can license NIRSEN background IPs, should this be needed and desired.

NIRSEN has in-house silicon-proven building blocks and systems on a chip for millimeter-wave communication and radar front ends, ready to be used as is or to be adapted for customer needs. We control the entire analog and digital ASIC development flow, with customer tools (operating over VPN) or our tools. NIRSEN offers, on one hand, a Virtual Design Center business model and, on the other, turnkey solutions consisting of analog, RF and mixed-signal ASIC & digital ASIC design for system OEMs and T1s. Our Virtual Design Center model enables a long-term engagement of engineers with dedicated competencies, such as high-voltage design & layout activities, generic AMS design & layout activities, digital design & validation activities, or mixtures thereof. With our engineers located in NIRSEN office, the service is delivered in a remote, agile and affordable way. We can provide custom application-related firmware solutions, with porting options on a dedicated SoC platform.

 
AMS, RF & mmWave IC designs

Expertise Core Domain

One stop shop for IC design services offers:

  • Analog mixed IC design & layout
  • RF & mmWave IC design & layout
  • High-voltage design & layout
  • Digital front-end & back-end design
  • FPGA verification & validation
  • ASIC validation with PCB reference designs for testing
AMS, RF & mmWave IC designs

Experience in Systems

A wide range of applications is available:

  • AMS solutions for sensor data acquisition & conditioning (Hall, MEMS, etc)
  • RF & mmWave communication front-ends
  • RF receivers
  • High performance custom PLLs
  • Automotive ICs & ASICs for e-Mobility
AMS, RF & mmWave IC designs

Target Markets

We enable autonomous and IoT solutions for:

  • Automotive market
  • Industrial & wireless market
  • Consumer market
  • Smart home market
  • Medical market
AMS, RF & mmWave IC designs

Technologies

Experiences in PDKs, major foundries, variety of technologies and nodes is available:

  • CMOS, BiCMOS, SiGe, BCD
  • TSMC, IHP, GF, TowerJazz, XFAB, UMC, STM, AMS, Samsung TI, GF…
  • 22 nm – 0.35 μm

We enable full vertical integration for your future products, with your own silicon parts.

Analog IPs

NRC60A1 Silicon details

  • 1TX-1RX FMCW Radar Sensor Chip
  • 55-64GHz, 2×3 mm2, PLL on Board, Baseband processing, SPI Interface
  • Antenna-on-PCB or
  • Antenna-in-Package

AMS, RF & MMWAVE IC SERVICES

From system design up to GDSII with/without NIRSEN IPs

  • High-voltage design including BCD processes layout
  • High-voltage design for e-mobility (automotive market segment)
  • Special expertise in RF (up to 30 GHz) and mm-wave (30 – 300 GHz) IC design
  • We do low-power IC design (low nodes down to 22 nm) with special experience for wireless systems and SoCs for sensor applications
  • CMOS, BiCMOS, and SiGe
  • Technologies: TSMC, TowerJazz, IHP, XFAB, UMC, STM, AMS, TI, GF, etc.
  • 22 nm – 0.35 μm
FPGA Team

SoC, FPGA & ASIC

The development of high-speed, high-transfer industrial and IoT systems

  • Xilinx Zynq multiprocessor system-on-chip (MPSoC) programmable logic (PL) and processing system (PS) development
  • SoC design for sensor data processing
  • FPGA/ASIC implementation
  • Hard and soft DSP implementation
  • WiFi algorithm development following 802.11a/g/ad/ah standards
    • WiGig direct multigigabit wireless communication
    • WiFi HaLow technology
  • High-speed FPGA multigigabit and multichannel-based HIL systems
real time logging and streaming platforms

hypr_ REAL-TIME PROCESSING & LOGGING PLATFORMS

hypr_gate logging and streaming platform

  • Low-latency streaming
  • Internal/external data logging
  • Sensor fusion support
  • Sensor data analysis and processing

hypr_risc radar hardware accelerator

  • Hardware and software solution for IC testing
  • IC/ASIC functional testing
  • IC/ASIC application-driven field trials
  • IC/ASIC validation